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A
real time X-ray inspection station is used to control the quality of assemblies
containing BGAs. This system allows us to verify proper reflow and
solder integrity of BGA balls. Customers can choose whether all BGAs
in a run are inspected or only a statistical sample. Printed reports are
also available.
X-ray inspection can help identify the following faults:
shorts
opens
misregistration
non-wetting
solder ball voids
popcorning |
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