Our capabilities and equipment list for electronic manufacturing includes the following:
 • Full SMT line for single or double sided assemblies
 • Automated solder paste screening
 • Automated 3D optical paste print inspection (AOI)
 • Multiple fully automated UIC GSM/PTF pick and place cells with dual head + dual camera vision systems
 • SMT component placement from 0402 size to 2" square
 • Odd form SMT placement using Matrix tray or manual methods
 • BGA placement down to 0.6mm (includes Micro BGA)
 • Over 10,000 parts per hour average SMT capability
 • PCB handling size of 2" x 3" up to 15" x 20"
 • 14 zone (7 top, 7 bottom) convection reflow oven with extensive profiling capabilities and lead-free reflow
 • X-Ray inspection station for BGAs and QFPs
 • Automated optical inspection system for fault finding on finished assemblies (AOI)
 • Fully equipped manual optical inspection + rework stations
 • Automated T1-3/4 LED insertion
 • Manual as well as PIP (pin in paste) THT operations
 • BGA/QFP rework station
 • Lead-free capabilities available upon request

Other value added services that we offer:
 • Electronics testing - IDERS can utilize customer-provided functional test apparatus or if required, an in-house certified test engineer can work with the client to design custom test fixtures that meet technical, functional and quality specifications.
 • Experience in testing using a wide range of standard test equipment for both digital and analog circuits, with a capability of up to 30GHz.
 • An in-house mechanical shop is available where manufacturing and assembly services can prototype and build anything from simple to complex enclosures and/or mechanical apparatus.
 • Full turnkey system assembly, testing, configuration and build tracking available.
 • Rework or repair of virtually any electronic assembly.
 • Environmental temperature stress testing from -65°C up to +125°C.
 • Failure analysis supporting the customer's needs.