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IDERS Hardware Design Capabilities
 

PCB Layout

CAD Board Outline Design

Placement
• Fine pitch SMT, BGA, and mBGA land pad design
• Layout using customer-provided library or using manufacturing-proven Iders library with 1000+ pads and footprints
• PCB feature geometry design scaling on manufacturer tolerances

Routing
• High-speed differential routing with large numbers of differential pairs
• Clock distribution networks
• Experience with high layer count (20+ layers)
• High density interconnect
• Constraint-driven auto-routing

Signal Safety and Integrity
• Power and high voltage rout ing with isolation
• Mixed signal layout techniques
• Signal integrity analysis
• Multi- layer controlled impedance
• Thermal management

DFx
• Post-processing for DFM
• Placement and panelization for mechanical stress mitigation during depanelization
• Design for in-circuit test and both visual and x-ray inspection
• Design for electromagnetic emission, regulatory, safety, environmental, and reliability testing
• PCB substrate selection and pad geometry design forRoHS manufacturing

Customer Hand-Off
• Professional documentation including Gerbers, drill files, and placement files

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